Testing Capabilities
KOTURA's 5,500 ft² Class 10K Testing and Packaging facility is used for the rapid prototyping and development of new packages. The highly experienced and skilled testing team works closely with contract service providers and our overseas packaging and assembly partner in China for volume manufacturing customers. The facility is equipped with number of state of the art commercially available measurement systems and custom jigs and fixtures for optical measurements, fiber pigtailing, wirebonding (ball and wedge), probe station, curing ovens, temperature cycling ovens, and temperature-humidity ovens for reliability testing.
KOTURA is fully equipped for thermal and electrical characterization of Si-based modules. Thermal management equipment includes TEC and heater controllers, calibrated temperature sensors and air flow tunnel for heat dissipation control.
In-house test facilities include chip-level automated-alignment test stations and module test stations. A number of Newport alignment stations are used for precisely optical alignment aided with image and video capture facilities.
Electronic test equipment for frequency characterization and other measurements is also available, including: oscilloscopes, function generators, power supplies and other standard equipment. KOTURA is well equipped for data transmission characterization of modulators and active devices at transmission rates up to 12 Gbps.
